About Us

What are we doing?

We offer a range of services, including multi-layer PCB design, high complexity card designs, and high-speed interfaces such as Fiber, PCIE, and Aurora. Our team is experienced in designing FPGA, microprocessor, and DSP cards, as well as mixed signal (analog + digital) card designs, IPC compliant PCB designs, power board design, and motherboard design.

We take pride in our fully automatic SMD typesetting line, which has a capacity of up to 350,000 materials per day, allowing us to offer fast and high-quality production for single or double-sided electronic cards. Our personnel are trained to meet IPC-A-610 & IPC J-STD-001 standards, ensuring that soldering is performed with or without lead, based on customer demand. Our commitment to using the latest technology and adhering to industry standards allows us to offer our customers accurate, reliable, and high-quality electronic products.

Certified Quality

We take pride in being a certified organization with ISO 9001:2015, OHSAS 18001:2007, and ISO 14001:2015 certificates. These certifications demonstrate our commitment to maintaining the highest standards in quality management, occupational health and safety, and environmental management.

By achieving these certifications, we are able to provide our customers with the assurance that we are a reliable and responsible supplier, committed to delivering high-quality products in a safe and sustainable manner.

Quality Certified Components

All the components we use have quality control and qualification certificates.

High Production Capacity

We can assemble 72.000 components per hour in a single production line.

Quality Control

All products are checked in detail with 3D analysis, x-ray and flying probe.

Our Services

Electronic Design

  • Multi-Layer PCB Design

  • FPGA, Microprocessor, DSP Card Designs

  • High Complexity Card Designs

  • High Speed Interfaces (Fiber, PCIE, 10G, Aurora,…)

  • Mixed Signal (Analog+Digital) Card Designs

  • IPC Compliant PCB Designs

  • Power Board Design

  • Motherboard Design

SMD Typesetting

  • Components that can be stacked 01005, 0201,0402, BGA, QFP, QFN, CSP (0.3 mm pitch)

  • Soldering Check with X-Ray

  • Washing Process

  • Control of Cards with Automatic Optical Control (AOI)

  • Soldering and Desoldering Devices for Components

  • Thermal Tests with Aging Cabinet

  • Mechanical Assembly